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Chip-level (TIM1) thermally conductive gel

Chip-level (TIM1) thermally conductive gel

Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.

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Thermal conductive frame bonding - AD adhesive

Thermal conductive frame bonding - AD adhesive

Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.

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Conductive silver paste

Conductive silver paste

Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.

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Epoxy low-temperature silver paste

Epoxy low-temperature silver paste

Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.

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