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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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Reactive polyurethane hot melt adhesive
One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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Two-component structural adhesives are mainly composed of resin and curing agent. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Two-component room temperature curing structural adhesive
Two-component structural adhesives are mainly composed of resin and curing agent. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Instant adhesive is mainly composed of a-cyanoacrylate monomer, plasticizer, stabilizer and polymerization inhibitor. The curing principle is based on the reaction of water vapor in the air and on the surface of the adhesive. It is a single component adhesive with fast setting, good temperature resistance and durability, and can be widely used to bond most materials.
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Instant adhesive is mainly composed of a-cyanoacrylate monomer, plasticizer, stabilizer and polymerization inhibitor. The curing principle is based on the reaction of water vapor in the air and on the surface of the adhesive. It is a single component adhesive with fast setting, good temperature resistance and durability, and can be widely used to bond most materials.
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The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.
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The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.
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