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Bottom filler

Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.

Keywords:

Trumjin

Category:

Filler

Product Inquiry:

86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Bottom filler

    Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.

    Product Introduction

    Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of chips (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.

     

    Product Parameters

    Model Appearance

    Viscosity

    (mPa.s)

    Shear Strength

    (MPa)

    Tg

    (℃)

    CTE1

    (ppm/°C)

    CTE2

    (ppm/°C)

    		Product Features Typical Applications
    H2105 Black 400   115 50 165
    • Rapid flow at room temperature
    • Rapid curing at medium temperature
    • Low CTE
    • Reworkable
    • Excellent Reliability
    		BGA/CSP packaged chips
    H2180 Black 800   103 57 165 BGA, CSP, etc. underfill, FBGA reinforcement
    H2181 Black 50000   130 30 105 Corner packaging process for board-level chip assembly
    H2420 Black 10000 6 130 25 67 Chip packaging CSP, Flip-Chip, etc. process design
    H2422 Black 30000   135 22 55 Chip packaging CSP, Flip-Chip, etc. process design
    H2715 Black 800   103 57 165 Reworkable underfill material for CSP, FBGA or BGA chips
    H2725 Black 5000   125 28 105 Reworkable underfill material for WLCSP and Flip chip chips

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