Application Area
Serving manufacturing enterprises in the fields of semiconductor packaging, consumer electronics, automotive electronics, and new energy.

Advanced Packaging

Consumer electronics

Automotive electronics

Industrial Manufacturing

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Advanced Packaging

I. Industry Analysis

1. Concept

In terms of definition, it is a packaging technology that transcends traditional packaging methods and can achieve higher performance, smaller size, and more functional integration. Traditional packaging mainly protects the chip and provides simple pin connections, while advanced packaging emphasizes system integration and functional diversification.

2. Forms

In terms of technology, it includes various forms. For example, 2.5D/3D packaging, which vertically stacks multiple chips to effectively reduce the packaging area and significantly shorten the communication distance between chips, improving data transmission speed; there is also system-in-package (SiP), which integrates chips with different functions, such as processors, memory, and sensors, into a single package to form a complete system, like a multifunctional chip module.

3. Materials

Advanced packaging uses rather special materials. For example, high-performance underfill materials are used to enhance the connection strength between the chip and the packaging substrate, and new packaging substrate materials are also used to meet higher electrical performance and heat dissipation requirements.

4. Applications

In terms of applications, advanced packaging is widely used in numerous high-tech fields. In the field of artificial intelligence, advanced packaging helps improve chip computing power to meet the computational needs of complex machine learning algorithms; in high-performance computing, it allows computer processors and other chips to work together better, accelerating data processing; in consumer electronics, such as smartphones, advanced packaging enables smaller size and more powerful functions.

 

II. Market Analysis

1. Market Size

The global advanced packaging market size continues to grow, reaching approximately US$43.9 billion in 2023, a year-on-year increase of 19.62%, and is expected to grow to US$47.25 billion in 2024. The Chinese advanced packaging market is also developing steadily, reaching 64 billion yuan in 2023, with an increase in penetration rate, and is expected to grow by 40% in 2024.

2. Technological Development

In 2024, FCBGA, FCCSP, and 2.5D/3D packaging technologies will become the mainstream in the market, with 2.5D/3D packaging technology showing the fastest growth rate. Chiplet and 3D packaging are attracting attention, with increased investment and mass production of 3D packaging technology.

3. Application Fields

Advanced packaging is widely used in multiple fields with growing demand.

(1) In the AI and high-performance computing fields, with the development of AI, the demand for chips with high computing power, high bandwidth, and low latency has surged, making advanced packaging technology crucial;

(2) In the consumer electronics field, the development of portable electronic products has driven the application of advanced packaging technology due to the requirements for miniaturization, high performance, and low power consumption;

(3) In the communication field, the development of 5G and future 6G communication technologies requires advanced packaging to achieve efficient integration and signal transmission of wide-bandgap semiconductor devices.

 

III. Technological Development Trends

1. Higher Integration: Heterogeneous integration technology integrates chips or modules with different functions and processes to achieve system-level integration, improving performance and functional diversity; three-dimensional packaging technology increases integration by stacking chips, shortening signal transmission distances.

2. Miniaturization and Thinning: Meeting the demand for thinner and lighter electronic devices, driving continuous reduction in packaging size and thickness.

3. High Performance and Low Power Consumption: Using new heat dissipation materials and structures to optimize power management; developing low-power packaging processes and materials to reduce chip energy consumption.

4. Intelligence and Automation: Driven by Industry 4.0, automation and intelligent technologies are widely used in packaging production to improve efficiency, quality, and consistency, reducing costs and reliance on human labor.