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Epoxy low-temperature silver paste

Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.

Keywords:

Trumjin

Category:

Conductive adhesive

Product Inquiry:

86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Epoxy low-temperature silver paste

    Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.

    Product Introduction

    Two-component epoxy silver paste for medium and low temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    Shear Strength

    (MPa)

    Volume Resistivity

    (Ω.cm)

    		Curing Conditions Product Features Typical Applications
    H2520 Epoxy Silver White 25,000 7 <5.0*10-4 65℃/120min
    • Good conductivity
    • Two-component, convenient storage
    • Excellent weather resistance
    • Suitable for high-precision dispensing
    • Replacement for welding, repair/ rework of interconnect components

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