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Chip-level (TIM1) thermally conductive gel

Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.

Keywords:

Trumjin

Category:

TIM1

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86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Chip-level (TIM1) thermally conductive gel

    Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.

    Product Introduction

    Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision and high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), and large-size 5G communication chips. It has excellent properties such as low volatility, high thixotropy, and high reliability.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    Thermal Conductivity

    (W/m.k)

    		Curing Conditions Product Features Typical Applications
    TG395 Silicone Gray paste 330.00 4.0 90min@120℃
    • Low thermal resistance
    • High thermal conductivity
    • No pumping or cracking
    • Stable and reliable coverage
    		FC-BGA\CPU\GPU packaging process Chip heat dissipation
    TG650 Silicone Gray paste 360,000 6.5 90min@120℃
    TG760 Silicone Gray paste 182,000 7.3 90min@150℃

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