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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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Carbon fiber thermal conductive gaskets are made with silicone rubber as the matrix, filled with thermally conductive particles and carbon fiber/graphite fiber composites, and have good elasticity. Insulating carbon fiber gaskets are obtained through fiber treatment. At the same time, by changing the fiber and composite components, carbon fiber gaskets with both thermal conductivity and wave absorption functions are obtained, meeting the stringent requirements of high-end electronic devices.
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Carbon fiber thermal conductive gasket
Carbon fiber thermal conductive gaskets are made with silicone rubber as the matrix, filled with thermally conductive particles and carbon fiber/graphite fiber composites, and have good elasticity. Insulating carbon fiber gaskets are obtained through fiber treatment. At the same time, by changing the fiber and composite components, carbon fiber gaskets with both thermal conductivity and wave absorption functions are obtained, meeting the stringent requirements of high-end electronic devices.
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Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.
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Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.
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