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Thermal conductive frame bonding - AD adhesive

Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.

Keywords:

Trumjin

Category:

TIM1

Product Inquiry:

86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Thermal conductive frame bonding - AD adhesive

    Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.

    Product Introduction

    Chip thermally conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It combines thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increasing the connection strength between the packaging cover plate and the organic substrate, and improving the overall reliability of the chip.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    Tensile Strength

    (MPa)

    Elongation at Break

    (%)

    Shear Strength

    (MPa)

    Thermal Conductivity

    (W/m.k)

    Breakdown Strength

    (kv/mm)

    Volume Resistivity

    (Ω.cm)

    		Curing Conditions Product Features Typical Applications
    H6201 Silicone Light gray paste 82,000 5.7 37 5.0 1.75 45 ≥1× 1011 90min@125℃
    • High bonding strength
    • Good operability
    • Excellent thermal conductivity
    • Low volatility
    • High insulation performance
    • Excellent adhesion to metal, ceramic, PCB and other substrates
    		FC-BGA packaging
    H6202 Silicone Black paste 150,000 6.5 120 5.0 0.2 22 6× 1015 90min@125℃ FC-BGA packaging

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