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Conductive silver paste
Keywords:
Trumjin
Category:
Conductive adhesive
- Product Description
-
- Commodity name: Conductive silver paste
Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
Product Introduction
Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
Product Parameters
Model Type Appearance Viscosity
(mPa.s)
Shear Strength
(MPa)
Volume Resistivity
(Ω.cm)
Tg ℃ Curing Conditions Product Features Typical Applications H2159 Epoxy Silver 30,000 11 3*10-4 110 150℃/60min - Stable thixotropy
- Excellent conductivity
- High bonding strength
- Good reliability
- Chip mounting conductive bonding
H2157 Epoxy Silver 23,000 8 7*10-4 80 120℃/60min - Stable thixotropy
- Excellent conductivity
- Good reliability
- High bonding strength
- Camera module
- Fingerprint module
- FPC flexible circuit board
H2155 Epoxy Silver 20,000 5 5*10-4 120℃/30min - Stable thixotropy
- Excellent conductivity
- Good reliability
- High bonding strength
- Printed circuit board components
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