Application Area
Serving manufacturing enterprises in the fields of semiconductor packaging, consumer electronics, automotive electronics, and new energy.

Advanced Packaging

Consumer electronics

Automotive electronics

Industrial Manufacturing

Perovskite

Thinner, Smaller, and More Reliable: Material Innovation Applications in the Trend Toward Miniaturization of Consumer Electronics

Consumer electronics—such as smartphones, TWS earphones, and wearable devices—are constantly evolving toward trends of “lightweight, thin, compact, and miniaturized” designs combined with integrated functionality. This trend poses significant challenges to the assembly materials and processes used for internal components. Hunan Chuangjin Technology Co., Ltd. focuses on this field and provides specialized materials tailored for miniaturization and high-density assembly.

1. Precision dispensing and bonding materials

To securely mount tiny components—such as MEMS sensors and passive components in 01005 size—within a limited space, the adhesive must possess: Excellent construction performance (e.g., no stringing, clean glue breakage) Its rapid curing properties, combined with a moderate modulus and toughness after curing, ensure both sufficient adhesive strength and prevent damage to brittle components caused by excessive stress.

2. Camera Module (CCM) Assembly Materials

Multiple cameras and high pixel counts in mobile phones place stringent demands on assembly materials. The adhesives used for lens locking, bracket bonding, and infrared filter attachment must possess: Extremely low volatile content, low hygroscopicity, and low shrinkage rate. To prevent contamination of the lens from affecting image quality, the material must also possess a certain degree of light-shielding properties (used for damming) to eliminate stray light.

3. Thermal Management and Electromagnetic Shielding

As chip computing power increases, thermal management in consumer electronics is becoming increasingly important. Thermal grease, thermal gel, phase-change materials It is used to efficiently conduct heat from the chip to the heat sink. Meanwhile, as the frequency increases, Conductive foam, conductive fabric, electromagnetic shielding adhesive These materials are crucial for suppressing electromagnetic interference (EMI) and ensuring signal integrity.

Chuangjin Technology is developing low-viscosity adhesives, fast-curing photopolymers, and specialized thermally conductive and electrically conductive materials tailored for precision dispensing equipment, aiming to provide design engineers in the consumer electronics industry with more options when addressing space constraints and reliability challenges.