Application Area
Serving manufacturing enterprises in the fields of semiconductor packaging, consumer electronics, automotive electronics, and new energy.

Advanced Packaging

Consumer electronics

Automotive electronics

Industrial Manufacturing

Perovskite

The Core Support for Advanced Packaging: Technological Development Trends and Application Challenges of Key Packaging Materials

As Moore’s Law approaches its physical limits, advanced packaging technologies—by boosting interconnection density and system integration—have become a crucial pathway for sustaining the development of the semiconductor industry. And the realization of any packaging technology is inseparable from... Key packaging materials supporting this endeavor. Hunan Chuangjin Technology Co., Ltd. is conducting ongoing research and technological development in this field.
1. Chip mounting materials: Achieving robust mechanical and electrical connections
The connection between the chip and the substrate or packaging carrier is crucial. In addition to traditional solder, Die Attach Film (DAF) Anisotropic conductive adhesives/films (ACP/ACF) and sintered silver pastes, among other materials, are becoming increasingly widely used. These materials need to achieve... High thermal conductivity, high electrical conductivity, and high bonding strength At the same time, it meets the process requirements for ultra-thin applications (such as below 10 μm) and boasts excellent thermal resistance and reliability.
2. Underfill: The Key to Enhancing Reliability
For structures that employ bump interconnections, such as flip chips, the underfill adhesive, by filling the gap between the chip and the substrate, can... Significantly alleviates stress caused by mismatched thermal expansion coefficients. This significantly enhances the thermal fatigue resistance of solder joints and extends the service life of components. In response to the challenges posed by narrow-pitch, large-size chips, the key technological focus lies in developing materials that exhibit excellent flowability, fast filling speed, low curing stress, and superior resistance to high temperatures and high humidity.
3. Encapsulating Materials and Thermal Management Materials: Striking a Balance Between Protection and Heat Dissipation
Epoxy molding compounds (EMCs) serve to protect chips and resist erosion from external environmental factors. Advanced packaging requires EMCs to possess... Low warpage, high fluidity, low ionic impurity content, and excellent heat resistance. Meanwhile, as power density increases, Thermal Interface Material (TIM) Its role is becoming increasingly critical, requiring a balance between high thermal conductivity and suitable construction workability.
Hunan Chuangjin Technology pays close attention to the above-mentioned technology development trends and is committed to developing supporting materials suitable for advanced packaging platforms, in order to meet the new material requirements posed by high-density, high-reliability packaging.