Application Area
Serving manufacturing enterprises in the fields of semiconductor packaging, consumer electronics, automotive electronics, and new energy.

Advanced Packaging

Consumer electronics

Automotive electronics

Industrial Manufacturing

Perovskite

Hunan Chuangjin Technology: A provider of advanced material solutions specializing in the semiconductor and electronics assembly sectors.

Today, as the electronics industry continues to advance toward higher performance, smaller sizes, and greater reliability, advanced packaging and assembly materials have become one of the key driving forces behind technological progress. Hunan Chuangjin Technology Co., Ltd. is positioned to become a company that... Specializing in advanced semiconductor packaging and electronic assembly. A high-tech materials enterprise dedicated to providing innovative material products and supporting process application solutions for customers across the industrial chain.
The company’s business primarily revolves around two core segments:
Advanced Packaging Materials for Semiconductors Serving the packaging stage following front-end semiconductor manufacturing. The product range may include chip bonding materials (DAF, conductive adhesives), underfill materials, molding compounds (EMC), thermal interface materials (TIM), and more, all of which are used in advanced packaging technologies such as FC-BGA, Fan-Out, and 2.5D/3D integration.
Electronic assembly materials Primarily used in printed circuit board assembly (PCBA) and system integration. Products may include solder paste, conductive adhesives, thermally conductive gels, three-proof coatings, surface-mount adhesives, as well as specialized assembly materials for consumer electronics products such as camera modules and acoustic components.
Chuangjin Technology, with materials research and development at its core and backed by a deep understanding of downstream processes, aims to provide customers in fields such as semiconductors, automotive electronics, and consumer electronics with viable technical support and material choices for enhancing product reliability, optimizing production efficiency, and addressing the challenges of miniaturization.