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Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.
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Chip-level (TIM1) thermally conductive gel
Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.
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Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.
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Thermal conductive frame bonding - AD adhesive
Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.
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Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
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Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
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Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.
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Epoxy low-temperature silver paste
Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.
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Conductive silver paste is a functional material mainly composed of silver powder as the conductive phase, mixed with a binder and solvent. It features high conductivity and printability, and is widely used in electronic devices for conductive connections, circuit fabrication, and sensor manufacturing.
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Conductive silver paste is a functional material mainly composed of silver powder as the conductive phase, mixed with a binder and solvent. It features high conductivity and printability, and is widely used in electronic devices for conductive connections, circuit fabrication, and sensor manufacturing.
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Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste
All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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