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Bottom filler

Bottom filler
Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.
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Bottom filler

Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.

Hotline: 86-400 863 9118

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Cushion filling glue

Cushion filling glue
High-performance, two-component liner adhesive boasts superior compressive strength, effectively enhancing the overall rigidity of equipment. It reduces liner deformation under high-pressure operating conditions, ensuring more uniform particle size reduction and preventing liner damage caused by uneven wear, thus significantly extending liner service life.
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Cushion filling glue

High-performance, two-component liner adhesive boasts superior compressive strength, effectively enhancing the overall rigidity of equipment. It reduces liner deformation under high-pressure operating conditions, ensuring more uniform particle size reduction and preventing liner damage caused by uneven wear, thus significantly extending liner service life.

Hotline: 86-400 863 9118

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