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Service Hotline:86-400 863 9118

Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan

Chip-level (TIM1) thermally conductive gel

Chip-level (TIM1) thermally conductive gel
Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.
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Chip-level (TIM1) thermally conductive gel

Used to fill micro-gaps and surface irregularities between the chip and the heatsink, mainly used for heat dissipation of various high-precision, high-integration chips, such as computer central processing units (CPUs), graphics processing units (GPUs), artificial intelligence chips (AI chips), 5G communication chips and other large-size chip thermal packaging. It has excellent properties such as low volatility, high thixotropy, and high reliability.

Hotline: 86-400 863 9118

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Thermal conductive frame bonding - AD adhesive

Thermal conductive frame bonding - AD adhesive
Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.
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Thermal conductive frame bonding - AD adhesive

Chip thermal conductive frame adhesive is a special adhesive used in chip packaging or heat dissipation systems. It has both thermal conductivity and bonding functions. Its main function is to bond the chip packaging cover plate to the surface of the organic substrate, increase the connection strength between the packaging cover plate and the organic substrate, and improve the overall reliability of the chip.

Hotline: 86-400 863 9118

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