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Thermosetting epoxy resin

Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.

Keywords:

Trumjin

Category:

Adhesive

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86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Thermosetting epoxy resin

    Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.

    Product Introduction

    Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the performance of the adhesive can be improved by adding fillers, tougheners, etc. It is mainly used for bonding various materials and has excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    		Thixotropy Ti
    (0.5/5rpm)     		Specific Gravity Hardness
    (Shore D)

    Shear Strength

    (MPa)

    		Tg
    (℃)     		Curing Conditions Product Features Application Scenarios
    H2001 Epoxy White 50,000 1.5 2.2 90D 12 101 150℃/60min Excellent heat resistance
    High bonding strength
    Good electrical insulation
    Reliable weather resistance     		Chip bonding, packaging of various microelectronic devices
    H2001T Epoxy Light yellow 40,000 1.5 2.3 96D 5 190

    110℃/30min+

    150℃/60min

    		Bonding, fixing, and filling holes of PCB products
    H2002 Epoxy White 23,000 1.5 2.3 98 15 112 150℃/60min Chip bonding, packaging of various microelectronic devices
    H2003 Epoxy Yellow 4,000 1.0 1.2 95 6   120℃/30min Fixing and protecting small motor coils, sealing motor coils
    H2004 Epoxy Light yellow 2,000 1.0 1.1 90 13 57 60℃/60min Fingerprint, camera module
    H2005 Epoxy Translucent 1,500 1.5 1.4 65D 16 46 60℃/60min Fingerprint, camera module
    H2006 Epoxy White 20,000 4.5 1.5 95D 11 44 60℃/60min Fingerprint, camera module
    H2009 Epoxy Red 140,000 6.4 1.2 75D 22 57 150℃/1min SMD component bonding
    H2057 Epoxy Gray Paste   1.4 80D 42 180 120℃/60min Magnetic core components, motor bonding
    H2122 Epoxy Black 21,000 (thixotropic) 4.7 1.6 88D 10 45 80℃/30min Fingerprint, camera module
    H2122W Epoxy White 40,000   1.5 86D 10 35 80℃/30min Fingerprint, camera module
    H2500 Epoxy Dark gray 140,000 4.0 1.5 85D 17 80 125℃/601min Inductor, magnetic core coil bonding

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