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Thermal conductive gel

One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.

Keywords:

Trumjin

Category:

Thermally conductive adhesive

Product Inquiry:

86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Thermal conductive gel

    One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.

    Product Introduction

    One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives. It is prepared by a special process and is in a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and can provide excellent design flexibility.

     

    Product Parameters

    Model Type Appearance Extrusion Rate
    (g/min)     		BLT
    (um)

    Thermal Conductivity

    (W/m.k)

    		Oil Seepage Rate
    (%)     		Volatile Matter
    (%)     		Product Features Typical Applications
    H6020 Organosilicon Pink Paste 310 100 2.0 <1 <1
    • Excellent Thermal Conductivity
    • Good Electrical Insulation
    • Irregular Structure Gap Filling
    • Long-Term Stability

    Mainly used in the electronics and electrical appliance fields, such as between the computer CPU and heat sink,

    between the mobile phone chip and the casing, between the LED lamp chip and the heat sink, etc.

    Used to fill the gap between the heating element and the heat dissipation component,

    eliminate the thermal resistance caused by air gaps, and improve heat dissipation efficiency.

    H6035lv Organosilicon Blue Paste 32 100 3.6 <1 <0.1
    H6060S Organosilicon Blue Paste 80 200 6.0 <1 <0.4
    H6560 Organosilicon Blue Paste 23 160 7.0 <1 <1
    H6080 Organosilicon Gray Paste 25 250 8.0 <1 <0.8
    H6090 Organosilicon Blue Paste 35 200 9.0 <1 <1
    H6100 Organosilicon Blue Paste 32 200 10 <1 <1
    H6321 Organosilicon Blue Paste 25 200 12 <1 <1

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