Product Center
Our vision is to become an excellent electronic packaging material enterprise in the industry.
Product Center
Service Hotline:86-400 863 9118
Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan
Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
View Details
Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
View Details
Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.
View Details
Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.
View Details
High-performance, two-component liner adhesive boasts superior compressive strength, effectively enhancing the overall rigidity of equipment. It reduces liner deformation under high-pressure operating conditions, ensuring more uniform particle size reduction and preventing liner damage caused by uneven wear, thus significantly extending liner service life.
View Details
High-performance, two-component liner adhesive boasts superior compressive strength, effectively enhancing the overall rigidity of equipment. It reduces liner deformation under high-pressure operating conditions, ensuring more uniform particle size reduction and preventing liner damage caused by uneven wear, thus significantly extending liner service life.
View Details
To improve the adhesion of coatings and adhesives to the following non-porous substrates: metals, plastics, glazed ceramics, and painted surfaces. This product is for experienced professional users only.
View Details
To improve the adhesion of coatings and adhesives to the following non-porous substrates: metals, plastics, glazed ceramics, and painted surfaces. This product is for experienced professional users only.
View Details
Service Hotline
Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan, China
Follow the official WeChat account
Copyright © HunanTrumjin Technology Co., Ltd.
This website supports dual IPv4 and IPv6 access
Business License
Powered by www.300.cn ChangSha