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Pressureless sintered silver

Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.

Keywords:

Trumjin

Category:

Conductive adhesive

Product Inquiry:

86-400 863 9118

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  • Product Description
    • Commodity name: Pressureless sintered silver

    Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.

    Product Introduction

    Pressure-sintered conductive material, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.

     

    Product Parameters

    Model Appearance

    Viscosity

    (mPa.s)

    Shear Strength

    (MPa)

    Volume Resistivity

    (Ω.cm)

    		Thermal Conductivity
    (W/m.k)     		Curing Conditions Product Features Typical Applications
    H2366 Yellow 13,000 >45 ≤8*10-6 >200 120℃/15min+270℃/3min
    • Service temperature exceeding 960℃.
    • Good heat dissipation capability.
    • Compatible with copper, silver-plated, and gold-plated surfaces
    		SIC, IGBT chip bonding

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