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All-sintered low-temperature sintering silver paste

All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.

Keywords:

Trumjin

Category:

Conductive adhesive

Product Inquiry:

86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: All-sintered low-temperature sintering silver paste

    All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.

    Product Introduction

    Fully sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    		Hardness
    shoreA

    Volume Resistivity

    (Ω.cm)

    		Thermal Conductivity
    (W/m.k)     		Curing Conditions Product Features Typical Applications
    H2350 Thermoplastic Resin Ocher 100-120 70A <6.0*10-6 >200 170℃/10min
    • Low Volume Resistivity
    • High Thermal and Electrical Conductivity
    • Pressureless Sintering Process
    • Excellent Interface Reliability
    		IGBT Chip Packaging
    H2352 Thermoplastic Resin Ocher 100-120 70A <4.0*10-6 >200 170℃/10min IGBT Chip Packaging

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