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Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan
Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste
All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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One-component thermally conductive gel is a high-performance material carefully developed for thermal management of modern electronic devices. It adopts an advanced formula, using high-quality organosilicon polymer as the matrix, uniformly filling high-purity, high-thermal-conductivity ceramic powder (such as alumina, boron nitride, etc.), and adding unique auxiliary additives, prepared by a special process, forming a uniform and stable gel state. It has the characteristics of low thermal resistance, high reliability, low required working pressure, strong adhesion, and reusability. The one-component thermally conductive silicone gel has been pre-cured and does not require re-curing during use, making it simple to operate. At the same time, it has low requirements for interface geometry and provides excellent design flexibility.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermal grease is a heat-conducting lubricating grease compound, often used as a thermal interface material between high-power electronic components and heat sinks. Thermal grease has good thermal conductivity and excellent printing and smearing properties. It can transfer heat from the chip to the heat sink, allowing the chip to operate at a safe and stable temperature, preventing damage to the chip due to poor heat dissipation, and extending its service life.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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Thermally conductive pads are made from a base of silicone rubber, with added thermally conductive fillers, flame retardants, and other functional additives. These pads offer good thermal conductivity and compression set, primarily used for heat dissipation, shock absorption, and buffering of heating components.
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Carbon fiber thermal conductive gaskets are made with silicone rubber as the matrix, filled with thermally conductive particles and carbon fiber/graphite fiber composites, and have good elasticity. Insulating carbon fiber gaskets are obtained through fiber treatment. At the same time, by changing the fiber and composite components, carbon fiber gaskets with both thermal conductivity and wave absorption functions are obtained, meeting the stringent requirements of high-end electronic devices.
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Carbon fiber thermal conductive gasket
Carbon fiber thermal conductive gaskets are made with silicone rubber as the matrix, filled with thermally conductive particles and carbon fiber/graphite fiber composites, and have good elasticity. Insulating carbon fiber gaskets are obtained through fiber treatment. At the same time, by changing the fiber and composite components, carbon fiber gaskets with both thermal conductivity and wave absorption functions are obtained, meeting the stringent requirements of high-end electronic devices.
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Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.
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Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.
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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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Reactive polyurethane hot melt adhesive
One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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