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Thermally conductive adhesive

Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.

Keywords:

Trumjin

Category:

Thermally conductive adhesive

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  • Product Description
    • Commodity name: Thermally conductive adhesive

    Thermally conductive adhesive is a material that possesses both structural bonding and good thermal conductivity. It is mainly used to bond electronic components to heat sinks.

    Product Introduction

    Thermally conductive adhesive is a material that combines structural bonding with good thermal conductivity. It is mainly used to bond electronic components to heat sinks.

     

    Product Parameters

    Model Type Appearance

    Viscosity

    (mPa.s)

    		Shear Strength
    (MPa)

    Thermal Conductivity

    (W/m.k)

    		Curing Conditions Product Features Typical Applications
    H2123 Epoxy Black 150,000-200,000 20 2.5 30min/80℃
    • Low-temperature thermosetting
    • High thermal conductivity
    • High bonding strength
    • Low shrinkage
    • Good weather resistance
    • Electronic equipment manufacturing
    • Communication equipment
    • Automotive electronics
    • Industrial control
    • Aerospace

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