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Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan
Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
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Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. It is composed of a resin matrix, conductive fillers, dispersing additives, and auxiliaries.
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Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.
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Epoxy low-temperature silver paste
Two-component epoxy silver paste for low and medium temperature applications, specifically designed for bonding metal, ceramic, and plastic components in electronics. These applications require materials with good adhesion, as well as electrical and thermal conductivity.
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Conductive silver paste is a functional material mainly composed of silver powder as the conductive phase, mixed with a binder and solvent. It features high conductivity and printability, and is widely used in electronic devices for conductive connections, circuit fabrication, and sensor manufacturing.
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Conductive silver paste is a functional material mainly composed of silver powder as the conductive phase, mixed with a binder and solvent. It features high conductivity and printability, and is widely used in electronic devices for conductive connections, circuit fabrication, and sensor manufacturing.
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Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Conductive shielding adhesives utilize electromagnetic shielding adhesives to create a closed loop around a certain area in space, thereby cutting off the propagation path of electromagnetic waves, weakening the field strength caused by certain sources, and eliminating electromagnetic interference.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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Pressureless sintered conductive material, suitable for chip interconnect applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied in typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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All-sintered low-temperature sintering silver paste
All-sintered low-temperature sintering silver paste, suitable for chip interconnection applications in high-power packaging. It forms a highly reliable joint with excellent thermal conductivity and can be directly applied to typical IGBT and SiC chip packaging processes.
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Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan, China
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