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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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UV curing adhesives, also known as ultraviolet curing adhesives, are mainly composed of base resins and photoinitiators. Under UV irradiation, they can quickly change from liquid to solid state, achieving efficient bonding. They are especially suitable for high-speed operations on assembly lines.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Epoxy adhesives are mainly composed of resin and curing agent. According to different application conditions, the properties of the adhesive can be improved by adding fillers, tougheners, etc. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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Reactive polyurethane hot melt adhesive
One-component reactive PUR hot melt adhesive is a high molecular material with polyurethane structure. Polyurethane has good adhesion to various substrates and excellent low-temperature performance. It also has comprehensive properties such as impact resistance, temperature resistance, wear resistance, and high peel strength. It is widely used in the bonding and assembly of frames and windows of products such as mobile phone casings, smart wearable devices, tablet computers, home appliances, touch panels, and in-vehicle displays.
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Two-component structural adhesives are mainly composed of resin and curing agent. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Two-component room temperature curing structural adhesive
Two-component structural adhesives are mainly composed of resin and curing agent. They are mainly used for bonding various materials and have excellent material properties such as high strength, low shrinkage rate, high temperature resistance, chemical resistance, and electrical insulation.
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Instant adhesive is mainly composed of a-cyanoacrylate monomer, plasticizer, stabilizer and polymerization inhibitor. The curing principle is based on the reaction of water vapor in the air and on the surface of the adhesive. It is a single component adhesive with fast setting, good temperature resistance and durability, and can be widely used to bond most materials.
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Instant adhesive is mainly composed of a-cyanoacrylate monomer, plasticizer, stabilizer and polymerization inhibitor. The curing principle is based on the reaction of water vapor in the air and on the surface of the adhesive. It is a single component adhesive with fast setting, good temperature resistance and durability, and can be widely used to bond most materials.
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The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.
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The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.
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Conformal coating is a high-polymer insulating coating material. Applied to the surface of a printed circuit board (PCB), it forms a very thin protective film. This protects the PCB and components from electrochemical corrosion and short circuits caused by moisture, salt spray, sulfides, mildew, etc. It also provides resistance to vibration and high and low temperature shock, improving the stability of the PCB, increasing its safety factor, and extending its service life.
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Conformal coating is a high-polymer insulating coating material. Applied to the surface of a printed circuit board (PCB), it forms a very thin protective film. This protects the PCB and components from electrochemical corrosion and short circuits caused by moisture, salt spray, sulfides, mildew, etc. It also provides resistance to vibration and high and low temperature shock, improving the stability of the PCB, increasing its safety factor, and extending its service life.
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A single-component, room-temperature-curing, solvent-based protective adhesive designed for the electronics industry. Primarily used for insulation, moisture-proofing, and protection of precision electronic components such as liquid crystal modules (LCMs) and touch screens.
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A single-component, room-temperature-curing, solvent-based protective adhesive designed for the electronics industry. Primarily used for insulation, moisture-proofing, and protection of precision electronic components such as liquid crystal modules (LCMs) and touch screens.
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One-component, screen-printing and baking type protective blue glue, mainly used in supporting materials for the OGS, CG, and CTP touch display industry.
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Capacitive screen protective blue glue
One-component, screen-printing and baking type protective blue glue, mainly used in supporting materials for the OGS, CG, and CTP touch display industry.
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Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.
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Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.
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Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
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Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
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Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.
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Underfill is a functional adhesive used in electronic assembly, primarily for filling the microscopic gaps between the bottom of a chip (such as BGA, CSP, Flip Chip, etc.) and the PCB. Its core function is to enhance the mechanical connection between the chip and the PCB, improving product reliability and resistance to environmental stress.
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