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Potting compound

Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.

Keywords:

Trumjin

Category:

Potting compound

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  • Product Description
    • Commodity name: Potting compound

    Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.

    Product Introduction

    Electronic potting compound is a polymer material specifically designed for encapsulating electronic components, circuit boards, and devices. It fills, seals, and protects electronic components from environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.

     

    Product Parameters

    Model Type Ratio A/B Appearance Viscosity (mPa.s) Density
    (g/ml)     		Hardness
    (Shore)     		Tg
    (℃)     		Thermal Conductivity (W/m.k) Dielectric Strength
    (kv/mm)     		Flame Retardant
    (UL94)     		Pot Life at 25℃
    (min)     		Curing Conditions
    (Room Temperature/Heating)     		Typical Applications Product Features
    H2082 Epoxy, thermally conductive 6:1 Black 3000 1.6 85D 55 1   HB 180

    60℃ * 1h

    +80℃ *1h

    		Motor stators, transformer coils, transmission devices, relays, sensors, electronic power modules, and other components Room temperature or heat curing
    High thermal conductivity
    Good bonding performance
    Corrosion protection and insulation
    Resistant to thermal shock
    H2083 Epoxy, thermally conductive 10:1 Gray 4000 1.8 85D 55 1.2     240 25℃/24h or 80℃/2.5h
    H2085 Epoxy, thermally conductive 10:1 Gray 10000 2.0 85D 92 2.5     150 25℃/8h or 80℃/30min
    H2086 Epoxy 1:1.5 Black transparent 1200 1.2 85D 105 /     60 100℃/60min Optical component encapsulation Low viscosity, low stress, good weather resistance
    H3040 Polyurethane 1:1 Yellow transparent 500 1.1 35A 10.0     V0 20 25℃/48h or 60℃/180min Electronics, electrical appliances, lighting fixtures, electronic controller potting Moderate hardness
    Excellent waterproof and insulation performance
    Environmentally friendly
    H3400 Polyurethane 10:3 Black 500 1.2 85A 15.0       25 25℃/6h or 60℃/60min
    H6080 Silicone 1:1 Colorless transparent 1000 1.0       20   70 25℃/24h LED lens potting, TP screen
    LCM module optical bonding     		Ultra-low stress, weather resistance, self-healing, insulation
    H6085S Silicone 1:1 Colorless transparent 600 1.0       18   120 25℃/24h or 80℃/30min Potting of small appliances, LED lens potting, IGBT potting Ultra-low stress, weather resistance, self-healing, insulation
    H6160 Silicone 10:1 Colorless transparent 1000 1.0       18   30 25℃/24h Outdoor lighting, sensors, automotive electronics Good fluidity, high hardness, high transparency, impact resistance, high temperature resistance, good weather resistance, no yellowing
    H6162D Silicone 1:1 Colorless transparent 50000 1.0 45(00)     20   5 25℃/10min Optical devices, solar panels Ultra-low stress, high transparency, good adhesion, good weather resistance
    H6165 Silicone - Colorless transparent 5000 1.0 30D     20    

    5000mj/cm2

    +120℃ *1h

    		Optical bonding, Mini LED potting UV + thermal curing, high hardness, high transparency, good bonding performance, low water absorption, insulation
    H6220LC Silicone 1:1 Black, white, gray 2500 1.7 70A   0.8 18 V0 45 25℃/24h or 80℃/30min LED power supplies, sensors, transformers, car lamp ballasts, general electronic components, power modules Low viscosity, good fluidity, low shrinkage during curing, good thermal conductivity, electrical insulation, good weather resistance

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