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Silicone sealant

The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.

Keywords:

Trumjin

Category:

Adhesive

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86-400 863 9118

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Related Products
  • Product Description
    • Commodity name: Silicone sealant

    The silicon-oxygen bond energy in the molecular structure of organosilicon is very high, so organosilicon materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.

    Product Introduction

    The silicon-oxygen bond energy in the molecular structure of silicone is very high, so silicone materials usually have excellent advantages such as high temperature resistance, aging resistance, chemical solvent resistance, shock resistance, insulation, and good elasticity.

     

    Product Parameters

    Model Type Appearance Surface Dry Time (min) Hardness
    (Shore D)     		Tensile Strength (MPa) Elongation at Break (%) Shear Strength (MPa) Dielectric Strength
    (kv/mm)     		Flame Retardant
    (UL94)     		Curing Conditions Product Features Application Scenarios
    H6291 Silicone White, Gray, Black 15 35A 2.0 500 2 18 V0 25℃/24h 2mm Room Temperature Cure
    Neutral, alcohol-free, low odor, non-corrosive to metal materials
    Excellent temperature resistance (-45~200℃)
    No primer required, excellent adhesion to a variety of materials
    Excellent electrical insulation and stability     		Substitute for Wacker 9111
    H6311 Silicone White 10 70A 1.0 100 1.2 12 V0 25℃/24h 2mm Electronic component bonding, fixing, insulation, and encapsulation
    H6312 Silicone White, Gray, Black 8 40A 2.5 430 2.3 22   25℃/24h 2mm Electronic component bonding, fixing, insulation, and encapsulation
    H6313 Silicone Translucent 8 30A 1.0 80 1.2 12   25℃/24h 2mm Electronic component bonding, fixing, insulation, and encapsulation
    H6314 Silicone Translucent, Black 15 30A 2.5 300       25℃/24h 2mm Electronic component bonding, fixing, insulation, and encapsulation
    H6318 Silane Modified White, Black 10 45A 3.2 220 5 10   25℃/24h 2mm Substitute for Dow Corning 8008

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