Product Center
Our vision is to become an excellent electronic packaging material enterprise in the industry.
Product Center
Service Hotline:86-400 863 9118
Address: Building 5, Blue Moon Valley Intelligent Manufacturing Industrial Park, Xieyuan North Road, Ningxiang Economic Development Zone, Changsha, Hunan
Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.
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Electronic potting compound is a polymer material specifically used for encapsulating electronic components, circuit boards, and devices. By filling, sealing, and protecting electronic components, it prevents them from being affected by environmental factors (such as moisture, dust, vibration, and temperature changes) and mechanical stress.
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Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
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Epoxy potting compound designed for power device modules, featuring high-temperature resistance and high reliability.
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